HOTBAR BONDING SYSTEMS
Toddco Systems produces the the widest selection of Hotbar Bonding Systems in the world.
From the most basic constant-heat desktop machines to fully automated pulsed heat integrated solutions, Toddco can match your needs to the right equipment.
Hotbar Bonding Systems are used in a variety of processes, including:
- Solder Reflow
- Heat Seal Bonding
- ACF Bonding
- Chip-On-Flex (COF) Bonding
- Chip-On-Glass (COG) Bonding
- TAB Bonding
- Flex Circuit Bonding
For more information, speak to a Toddco representative at (858) 271-9229.
Or, click HERE to tell us more about your application requirements.
To learn more about some of the equipment offered by Toddco, click on
one of the links below:
