Hotbar Bonding Equipment
TG-2000 Hotbar Bonder
The TG-2000 is the latest addition to our product line. The dual hotbar actuator design can reduce the frequency of changeovers by 50%. The TG-2000 system can be used in solder reflow, heat seal bonding, and TAB bonding.
TG-1000 Hotbar Bonder
With modular options for virtually any hotbar bonding operation, the TG-1000 easily transforms from a feature rich prototyping system to a high-throughput production cell optimized for your specific requirements.
TG-500 Hotbar Bonder
The TG-500 is a bench-top hotbar bonding system with high level process development features, precision process controls and ergonomic safety features. The TG-500 allows you to save space with features that you come to expect from a larger system.
T-300 ACF Tacker
The T-300 ACF Tacker is a product specifically designed to prep ACF material on a substrate, prior to bonding. This cost saving machine can double throughput at a fraction of the price of a full sized bonding system.
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