New Addition to the TODDCO Bonder Family

TG-2000 Series

TODDCO, a leading manufacturer of hotbar bonding equipment and systems, recently delivered and installed their new TG-2000 series for ACF bonding, hotbar soldering and heat seal bonding. The unique dual actuator design saved the customer 50% changeover time per assembly. The system was specifically designed for two bonding locations, which is extremely useful for a flex to LCD and PCB bonding process. The TG-2000 series is capable of handling other challenging assembly applications, like flex-to-flex, flex-to-PCB, and wire-to-PCB assembly, as well as rework.

The series includes a wide range of product handling features to tailor the bonder for use in particular applications, including motorized X-Y product stages and rotary tables. Vision enhancements assist with part alignment down to 25 microns. Additional options for the TG-2000 series include alignment stages, Kapton/Sarcon feeders, and customized product jigs.