TG-500 Hotbar Bonding System for UHD Edge Connectors
TG-500 Hotbar Bonding System
TODDCO has developed a version of the TG-500 Hotbar Bonding System to automate soldering the Amphenol TB-2031 Ultra High Density M1050 Series* edge connector.
The TG-500 Hotbar Bonding System is a pulsed-heat hotbar soldering system with modular options that accommodate a broad range of process requirements. For Ultra High Density (UHD) connector soldering, the TG-500 includes a motorized X-Y stage, a camera system with dedicated front-panel display, a G3C Ceramic Hotbar (thermode) and tooling that inserts the PCB assembly into the UHD connector and aligns fine wire leads to pre-tinned solder pads. TODDCO’s production ready philosophy includes customized tooling and ceramic hotbars that are designed for specific production requirements like UHD connector soldering.
TG-500 is a bench-top hotbar soldering system with high level process development features, precision process controls and ergonomic safety features. System software includes variable pressure control that allows bond pressure to increase as solder reflows; a graphical bond profile screen that guides development of critical process parameters; and two levels of password security to identify users and allocate access levels. Data logging of actual process performance is also a standard feature.
“We started our business in the 80’s soldering high density connectors to high cost avionics PCB’s. Our new Alignment Fixture and TG-500 Hotbar soldering system makes it even easier! I can’t even imagine doing it by hand anymore. It takes so little time with a huge improvement in product yield; the system quickly justifies itself. Even operators with little or no experience can be trained quickly to ‘turn a knob’ for alignment and ‘push the button’ to solder the connector in a fraction of the time required for hand soldering,” says Thomas W. Todd, President/CEO of TODDCO.